banner
Home » Knowledge » Content
Product Categories

COG display

- Jan 09, 2018 -


COG是chip on glass的缩写,即芯片被直接绑定在玻璃上。这种安装方式可以大大减小LCD模块的体积,且易于大批量生产,适用于消费类电子产品的LCD,如:手机,PAD等便携式产品,这种安装方式,在IC生产商的推动下,将会是今后IC与LCD的主要连接方式。

COG is the abbreviation of the chip on glass, that is, the chip is directly bound to the glass. This installation method can greatly reduce the volume of the LCD module, and easy mass production, suitable for consumer electronic products such as mobile phone, LCD, PAD and other portable products, this type of installation, in promoting the producers of IC, IC and LCD will be the main connection mode.

COG工艺/制程技术

COG process / process technology

COG制程是利用覆晶(Flip Chip)导通方式,将晶片直接对准玻璃基板上的电极,利用各向异性导电膜(Anisotropic Conductive Film,后面简称ACF)材料作为接合的介面材料,使两种结合物体垂直方向的电极导通。当前COG接合制程的生产作业流程,均以自动化作业方式进行。COG接合作业由各向异性导电膜贴附,FPC预绑定和FPC本绑定三个作业组成

COG process is the use of flip chip (Flip Chip) conduction mode, the direct wafer alignment electrode on the glass substrate, using anisotropic conductive film (Anisotropic Conductive Film, hereinafter referred to as ACF) as material interface bonding materials, two kinds of combination of vertical electric conduction pole. At present, the production process of COG joint process is carried out in automatic operation mode. COG engagement is composed of anisotropic conductive film attached, FPC prebinding and FPC binding three jobs

(一)各向异性导电膜导电膜贴附

(1) conductive film attached to an anisotropic conductive film

首先COG生产作业流程中第一个步骤是将ACF贴附在LCD电极部,接着将ACF离型纸撕除,仅剩ACF贴附在LCD电极部上面,完成ACF贴附作业。

First of all, the first step in the COG production process is to attach ACF to the LCD electrode part, then tear the ACF release paper, and only ACF is attached to the LCD electrode part to complete the ACF attachment operation.

(二)FPC预绑定

(two) FPC prebinding

将完成ACF贴附作业的LCD搬送到IC预绑定工程进行IC预绑定作业,此工程需将IC对位到LCD相对的电极上,因此需进行CCD影像读取识别,透过电脑影像处理系统,分别识别IC和LCD上预设识别位置,由电脑自动运算相对坐标后可以准确将IC贴在LCD电极上,完成IC预绑定作业。

ACF will complete the attached operations LCD IC pre operation to move the binding IC binding pre project, this project will be IC on relative to the LCD electrode, so need to read through the CCD image recognition, computer image processing system, IC and LCD respectively to identify the preset identification position, by a computer automatic calculation of relative coordinates after accurately IC posted on the LCD electrode, the completion of the pre IC binding activity.

(三)FPC本绑定作业

(three) FPC bindings

最后将完成IC预绑定作业LCD搬运到IC本绑定工程进行IC本绑定作业,此工程是COG制程品质的关键,压着温度、压着压力、压着时间是ACF固化三要素,以下对其个别说明:

Finally, the IC pre binding operation LCD will be transported to the IC binding engineering for IC binding work. This project is the key to the quality of COG process. Pressing temperature, pressing pressure and pressing time are three elements of ACF curing.

1、压着温度:ACF接合胶材料主要是高分子树脂,主要可分为热固性(Thermal-Setting)与热塑性(Thermal Plastic)树脂两种,一般ACF制造商会提供ACF特性的技术资料。温度对于黏附性影响最大,太低的温度会导致树脂无法溶解,太高的温度便会使导电粒子流失,因此压着温度必须控制在最佳范围以确保制品的可靠性。

1, pressing temperature: ACF bonding material is mainly polymer resin, which can be mainly divided into two types: Thermosetting (Thermal-Setting) and thermoplastic (Thermal Plastic) resin, and the general ACF manufacturers provide technical data for ACF characteristics. Temperature has the greatest influence on adhesion. Too low temperature can cause resin to dissolve. Too high temperature will cause the loss of conductive particles. Therefore, the temperature must be controlled in the best range to ensure the reliability of products.

2、压着压力:对导通电阻影响最大,太小的压力会导致导电粒子与电极之间的接触面积不够,而发生导电不良的情形,而太大的压力会压破导电粒子降低导通电阻,因此压着压力必须控制在最佳范围以维持良好的导电性。

2, pressure: the maximum pressure on the resistance effect, too little pressure will cause the contact area between the conductive particles and the electrode is not enough, and the poor conductivity situation, but too much stress will crush the conductive particles reduce the conduction resistance, so the pressing pressure must be controlled to maintain good conductivity in the best range.

3、压着时间:由于ACF中的导电粒子的流动特性,压着时间必须搭配压着温度,两者之间会有相互影响,提高压着温度可缩短压着时间,降低压着温度就得增加压着时间,这两种参数搭配会使得Bump捕捉导电例子数能够提升。但是压着时间的增加将会降低产能。

3, the pressing time: because the flow characteristics of conductive particles in ACF, pressing time must have pressure temperature collocation, interaction between the two, increase the pressure temperature can shorten the pressing time, reduce the pressure temperature would increase the pressing time, these two parameters will make the Bump capture examples of conductive collocation the number can improve. But the increase in time will reduce the capacity.

综上所述,在IC本绑定作业参数的制定上最为重要,作业参数为压着温度、压着压力和压着时间三者之间有着交互影响,在制程品质和产能最为重要。

To sum up, the most important thing is to establish the binding parameters in IC. The interaction parameters between the three parameters are pressing temperature, pressing pressure and pressing time, which are most important in process quality and productivity.