The oled process 03
The module segment process cuts the packaged panel into the actual product size, and then performs various processes such as polarizer attachment, control circuit and chip bonding, and performs aging test and product packaging, and finally presents the product in the hands of the customer.
Cutting: the packaged AMOLED substrate is cut into a panel (1);
Panel test: perform panel lighting check (2);
Alignment: attach the AMOLED panel to the polarizing plate (3);
IC+FPC binding: link between driver IC and flexible printed circuit board (FPC) and AMOLED panel (4);
TP attach: attach AMOLED panel to cover Lens with touch sensor (5);
Module test: aging test and lighting check of the module (6).